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Delivering turnkey packaging services to ensure performance,reliability and quality in complex microelectronics.
Turn-key services for custom, high-performance microelectronics
- Design -->Assembly -->Test
- Supply chain & product life-cycle management
Design
- In-house electrical & thermo-mechanical package design
- Creating solutions to meet demanding IC packaging requirements
Assembly
- 18 lean cells in Class 10K cleanroom
- Production volumes of 100 to 100k parts per year
- Offer rapid prototyping & feasibility studies
- RoHS-compliance capable
Test
- High-speed wafer & package testing
- Analog, digital and mixed-signal test
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